Capabilities
Technical Capabilities
Density | Standard | Advanced & Development |
Minimum Line/Spacing - Internal 1/2 oz | .004 | .003 1/3 oz |
Minimum Line/Spacing - External 1/2 oz | .004 | .003 1/3 oz |
Minimum Drilled Hole Size | .010 | .008 |
Minimum Solder mask Web | .005 | .004 |
Aspect Ratio - Line Card | 12:1 | 14:1 |
Aspect Ratio - Backplane | 14:1 | 17:1 |
Land Size (Diameter over Drill) | .010 | .008 |
Thickness (Minimum / Maximum) | .007/.300 | .005/.440 |
Thickness Tolerance | +/- 10 % | +/- 7% |
Layer to Layer Registration | +/- .003 | +/- .001 |
Minimum Core Thickness | .004 | .003 |
Minimum Prepreg Fill | .025 | .002 |
BGA | .5 mm | .4 mm |
QFP | .5 mm | .4 mm |
HDI & VIAS | Standard | Advanced & Development |
BBV Mechanical Drill | .010 | .006 |
Minimum Laser Via (Drill / Capture Pad) | .006/.016 | .006/.014 |
Variable Depth Laser Via (Depth / Diameter) | .004/.006 | .004/.006 |
Microvia Aspect Ratio1 Layer Build Up2 Layer Build Up3+ Layer Build Up | 0.5:1
Yes
| n/a
Yes
Yes |
Controlled Impedance | Standard | Advanced & Development |
28 - 150 Ohms | +/- 10% | +/- 7% |
50 - 150 Ohms | +/- 10% | +/- 7% |
Copper Weights | Standard | Advanced & Development |
Min Outer Base Copper - plated layers | 1/2 oz | 1/3 oz |
Max Outer Base Copper - plated layers | 4 oz | Inquire |
Min Inner Copper Foil - non plated layers | 1/2 oz | 1/3 oz |
Max Inner Copper Foil - non plated layers | 3 oz | 5 oz |