Active PCB

Density

              Standard

Advanced & Development

Minimum Line/Spacing - Internal 1/2 oz

.004

.003 1/3 oz

Minimum Line/Spacing - External 1/2 oz

.004

.003 1/3 oz

Minimum Drilled Hole Size

.010

.008

Minimum Soldermask Web

.005

.004

Aspect Ratio - Line Card

12:1

14:1

Aspect Ratio - Backplane

14:1

17:1

Land Size (Diameter over Drill)

.010

.008

Thickness (Minimum / Maximum)

.007 / .300

.005 / .440

Thickness Tolerance

+/- 10 %

+/- 7%

Layer to Layer Registration

+/- .003

+/- .001

Minimum Core Thickness

.004

.003

Minimum Prepreg Fill

.025

.002

BGA

.5 mm

.4 mm

QFP 

.5 mm

.4 mm

 

HDI & VIAS

Standard

Advanced & Development

BBV Mechanical Drill

.010

.006

Minimum Laser Via (Drill / Capture Pad)

.006/.016

.006/.014

Variable Depth Laser Via (Depth / Diameter)

.004/.006

.004/.006

Microvia Aspect Ratio

0.5:1

n/a

1 Layer Build Up

Yes

 

2 Layer Build Up

 

Yes

3+ Layer Build Up

 

Yes

Controlled Impedance

Standard

Advanced & Development

28 - 150 Ohms

+/- 10%

+/- 7%

50 - 150 Ohms

+/- 10%

+/- 7%

 

Copper Weights

Standard

Advanced & Development

Min Outer Base Copper - plated layers

1/2 oz

1/3 oz

Max Outer Base Copper - plated layers

4 oz

Inquire

Min  Inner Copper Foil - non plated layers

1/2 oz

1/3 oz

Max Inner Copper Foil - non plated layers

3 oz

 
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