Production Road map
1. Material Prep- Shear material for job; Panel size, quantity and type of material, log laminate manufacturer and lot # on traveler, not necessary for multi-layers.
2. N/C Drill- (N/C) Drill panels or multi-layers flat per drill card and job traveler.
3. Drill Inspect- Inspect drilled panels.
4. Deburr- Sand panels to remove any burrs.
5. Desmear/Etchback- (Multi-layers only) Removes epoxy smear caused by drilling from inner layer interconnects, and conditions exposed glass fibers.
6. Sensitize- Chemically coats drilled hole wall with a conductive palladium deposit.
7. Clean for Photo- Clean copper before laminating resist
8. Laminate Plating Resist- Coat panels with plating resist.
9. Image- Expose image onto panels.
10. Develop- Chemically develop image.
11. Image Inspect- Visually inspect imaged panels.
12. Pattern Plate- Plate copper and tin/lead onto imaged panel.
13. Strip Resist- Removes plating resist.
14. Etch Inspect- Visually inspect panels before etch.
15. Etch- Chemically etch copper from panels.
16. Oil Fuse- Thermally alloys tin/lead plate for a reflowed solder deposit.
17. Nickel/Gold Plate- Plate nickel/gold tabs if required
18. Pre-Mask Inspect- Visual Inspection or AOI
19. Screen Solder Mask- Screen solder mask on panels. Traveler specifies type of mask, photo imageable or wet mask.
20. Screen Letter Screen- Screen letter screen on panels. Traveler specifies color of letter screen, white, yellow, or black.
21. Rout- (N/C) Rout parts to customer's specification.
22. Bevel/Slot Tabs- Bevel/Slot Tabs per print.
23. Electrical Test- Electrically test parts (Flying Probe or Bed of Nails Test is done - 100% of boards).
24. Final Inspection- Inspect 100% for conformity to all customer specifications.
25. Package and Ship- Ship per customer requirements.
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